20+
IP rights
COMPANY PROFILE
Computational optics for complete advanced-packaging inspection
Phasora3D Optical Imaging Co.,Ltd. supplies 3D imaging modules for complete online inspection of semiconductor packaging. Our headquarters is in Suzhou Industrial Park with a regional headquarters in Singapore. The core team brings experience in semiconductor equipment and advanced packaging from R&D through volume production and field delivery.
Our capabilities cover optical design, algorithm development, hardware integration and process adaptation. We hold more than 20 intellectual-property rights, including more than 10 invention patents and multiple PCT international patents.
As an early China-based company focused on computational optics, Phasora3D combines computation and optics to deliver high-performance, high-precision and stable 3D imaging solutions for semiconductor inspection and metrology equipment makers.
Our products support wafer micro-bumps, C4 bumps, BGA arrays, die bonding, wire bonding and SIP system-in-package processes.
10+
Invention patents
PCT
International patents
FULL-CHAIN CAPABILITY
Full-chain R&D and process adaptation
Optical design
Design imaging paths for reflective parts, small structures and complex depth-of-field scenes.
Algorithm development
Build proprietary capabilities in computational optics, 3D reconstruction and height measurement.
Hardware integration
Integrate cameras, illumination, projection and control into deployable imaging modules.
Process adaptation
Adapt inspection solutions to advanced packaging, micro-assembly and complete online inspection takt times.
VISION & MISSION
Long-term investment in advanced-packaging yield
Company vision
Become a benchmark company for semiconductor computational-optics 3D imaging modules.
Company mission
Improve CoWoS process yield and build the foundation for AI computing.
Core vision
Set a new standard for complete online 3D inspection of semiconductor packaging.
ADVANCED PACKAGING