PSR2000 Series / CASE 203
Designed for advanced packaging applications such as CoWoS, this solution performs 3D topography and cross-sectional profile measurement of microbumps on wafer surfaces, delivering synchronized 3D height and 2D grayscale outputs.
BACKGROUND
2.5D/3D advanced packaging (e.g., CoWoS) relies on high-density microbumps (μbump) for die-to-interposer and HBM-stack interconnection. Bump height, diameter, and coplanarity directly govern packaging yield and signal integrity, demanding fast, repeatable in-line precision metrology.
CHALLENGE
With bumps of only ~30 μm diameter and ~15 μm height in dense arrays, optical resolution and measurement repeatability are pushed to the limit. CoWoS further combines multi-layer stacking and large height differences across the FOV, while reflective interfaces such as wafer metal layers and UBM cause localized overexposure and data voids.
SOLUTION
The PSR2000U 3D inspection module reconstructs full-array microbump topography and cross-sectional profiles at 1.6 μm resolution. Engineered for highly reflective / mirror-finish parts, it handles wafer metal layers and specular surfaces without overexposure. One scan outputs synchronized 3D height maps, 2D grayscale images, and multiple bright-field / dark-field images, and fully reconstructs the 3D height model of an entire gold wire.
RESULTS
MEASUREMENT EVIDENCE
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