Applications

PSR2000 Series

Micro-assembly module inspection

Capture clear images of reflective dies and first/second bond points while measuring aluminium-wire arc height and die glue height.

Industry

Advanced semiconductor packaging / micro-assembly

Inspection scope

3D height measurement, 2D grayscale imaging, wire and dispensing process inspection

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PSR2000 Series

Lead-frame and high-speed optical module inspection

Synchronously present 3D height and 2D grayscale results for lead-frame CMOS sensors and 800G optical-module optoelectronic chips.

Industry

Lead frames / high-speed optical communication modules

Inspection scope

Die warpage, placement offset and surface topography defect inspection

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PSR2000 Series

3D Inspection of Micro-Bumps

Designed for advanced packaging applications such as CoWoS, this solution performs 3D topography and cross-sectional profile measurement of microbumps on wafer surfaces, delivering synchronized 3D height and 2D grayscale outputs.

Industry

Advanced Semiconductor Packaging / CoWoS

Inspection scope

Measurement of microbump height, diameter, coplanarity, and 3D topography

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PSR1000 Series

PCBA and BGA inspection

Inspect PCBA chips, resistors, capacitors and BGA solder balls with 3D maps, 2D height maps and profile sections.

Industry

Precision electronic structures / semiconductor packaging

Inspection scope

PCBA component geometry, BGA array and height-profile inspection

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