Micro-assembly module inspection

BACKGROUND

Project background

A micro-assembly module combines highly reflective dies, curved wires and dispensing structures. The same inspection flow must retain both 3D height and clear 2D defect images.

CHALLENGE

Inspection challenge

Conventional solutions can lose data on reflective surfaces and large wire arcs, while multi-layer structures increase refocusing and capture cycles.

SOLUTION

Solution

PSR2000 synchronously outputs 3D height and 2D grayscale maps so dies, bonds, aluminium wires and glue can be measured in one coordinate system.

RESULTS

Measurement results

• Aluminium-wire arc height is approximately 300 μm above the substrate.
• Die glue height is approximately 60 μm.
• Monitor wire shape and dispensing processes to reduce risks of squeeze-out, shorts, excess glue and missing glue.