MINGJIAN IMAGING
Reimagining advanced packaging inspection with computational optics
High-precision 3D imaging for online semiconductor packaging inspection across CoWoS, BGA, C4 and SIP.
About Mingjian Imaging
CORE PRODUCTS
Core products
High-precision 3D and synchronized 3D + 2D optical metrology for advanced packaging and precision electronics.
High-performance 3D optical metrology module
PSR1000 Series
A 3D inspection solution for PCBs, semiconductor packages and precision electronic structures, balancing measurement accuracy with inline production speed.
- Synchronized 3D and RGB output
- DLP digital structured-light imaging
- Multi-camera fusion
Synchronized 3D + 2D optical metrology module
PSR2000 Series
Built for die-bond, wire-bond and SIP inspection, delivering synchronized 3D + 2D measurement for advanced packaging, micro-assembly, high-speed optical modules and lead frames.
- Complete 3D wire-height data
- Synchronized 3D + 2D output
- Multi-target synchronized focus
ABOUT MINGJIAN
About us
Mingjian Imaging supplies 3D imaging modules for complete online inspection of semiconductor packaging, delivering high-performance, high-precision and stable solutions for inspection and metrology equipment makers.
Learn more- 20+
- Proprietary IP / PCT international patents
- 2 hubs
- Suzhou + Singapore footprint serving global customers
- Ready to deploy
- From module development to on-site process adaptation
Mission
Improve CoWoS process yield and build the foundation for AI computing.
Our values
Stay committed to independent innovation and customer-first growth.
Core strategy
Build full-chain 3D imaging modules around advanced packaging needs.
Development goal
Set a new standard for complete online 3D inspection of semiconductor packaging.
APPLICATIONS
Applications
Four verified inspection applications spanning micro-assembly, lead frames, micro solder paste, PCBA and BGA.
Micro-assembly module inspection
Capture clear images of reflective dies and first/second bond points while measuring aluminium-wire arc height and die glue height.
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Lead-frame and high-speed optical module inspection
Synchronously present 3D height and 2D grayscale results for lead-frame CMOS sensors and 800G optical-module optoelectronic chips.
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3D Inspection of Micro-Bumps
Designed for advanced packaging applications such as CoWoS, this solution performs 3D topography and cross-sectional profile measurement of microbumps on wafer surfaces, delivering synchronized 3D height and 2D grayscale outputs.
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PCBA and BGA inspection
Inspect PCBA chips, resistors, capacitors and BGA solder balls with 3D maps, 2D height maps and profile sections.
Learn moreOUR TEAM / CHIP COLLABORATION
Turn complex questions into one system map
Align chips, algorithms and software on one map so every decision can be verified.
The R&D team discussing a chip solution
NEWSROOM
News
Preview | Advancing semiconductor packaging together at IICIE 2026
Mingjian Imaging will showcase its advanced-packaging inspection capabilities at the 2026 IICIE International Integrated Circuit Innovation Expo.
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Preview | Mingjian Imaging to exhibit at Shenzhen Bay Chip Expo 2026
Mingjian Imaging will present advanced-packaging inspection solutions at the 2026 Bay Area Semiconductor Industry Ecosystem Expo.
Read moreVISION
Set a new standard for inline 3D imaging systems in semiconductor packaging inspection
Advance semiconductor packaging quality control through high-speed, high-precision inline inspection.
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