Lead-frame and high-speed optical module inspection

BACKGROUND

Project background

Optical communication chip placement and lead-frame structures demand high placement accuracy and consistent surface geometry.

CHALLENGE

Inspection challenge

The inspection must judge die warpage, placement offset and surface defects across reflective chips and complex lead structures.

SOLUTION

Solution

PSR2000 combines reflective-part measurement with synchronized 3D + 2D output to provide height and grayscale evidence in one field of view.

RESULTS

Measurement results

• 3D height and 2D grayscale maps for lead-frame CMOS sensors.
• 3D height and 2D grayscale maps for 800G optical-module optoelectronic chips.
• Support placement accuracy and reduce assembly failure risk.