BACKGROUND
Project background
PCBA and BGA inspection spans components with different heights, joints, solder-ball arrays and local profile dimensions.
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PSR1000 Series / CASE 204
PCBA and BGA inspection
Inspect PCBA chips, resistors, capacitors and BGA solder balls with 3D maps, 2D height maps and profile sections.
Case process
CHALLENGE
Inspection challenge
Large variation in component types and heights requires both wide-field scanning and repeatable measurement of small structures.
SOLUTION
Solution
PSR1000 outputs 3D maps, 2D height maps and profile curves for PCBA and BGA, helping identify component tilt, joint offset and warpage.
RESULTS
Measurement results
- Full-board PCBA 3D map and 2D height map.
- Profile evidence for chips, resistors and capacitors.
- BGA solder-ball array 3D results and ball-height profile curves.
MEASUREMENT EVIDENCE
Measurement evidence
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