Complete 3D wire-height data
Reconstruct the full 3D model of curved wires, capturing the apex and both bond regions for ball, arc-height and wire-shape measurement.
PRODUCT SERIES
PSR2000 Series
Synchronized 3D + 2D optical metrology module
Built for die-bond, wire-bond and SIP inspection, delivering synchronized 3D + 2D measurement for advanced packaging, micro-assembly, high-speed optical modules and lead frames.
OVERVIEW
Product overview
PSR2000 is Mingjian's self-developed high-performance synchronized 3D + 2D optical metrology module for complete die-bond and wire-bond process inspection.
Composite multi-surface LED lighting and multi-target synchronized focusing address reflective dies, missing data on large wire arcs and repeated capture of multi-depth parts.
Synchronized 3D + 2D output
Output 3D height data and multiple 2D defect images in one coordinate system, reducing integration and alignment complexity.
Multi-target synchronized focus
Capture clear 2D images of multiple layers and dies in one scan without repeated stage moves or refocusing.
Stable measurement of reflective parts
Measure die surface height and warpage in 3D while reducing data loss on highly reflective parts.
20 mm height range
All resolution configurations support a maximum measurement height of 20 mm.
Wide-field, high-speed imaging
Typical field of view reaches 14.95 × 11.2 mm with a typical speed of 700 ms/FOV.
SPECIFICATIONS
Specifications
| Parameter | PSR2000C-045-2318 | PSR2000C-016-1411 | PSR2000U-016-1411 | PSR2000U-010-0907 |
|---|---|---|---|---|
| Camera resolution | 5120 × 4096 | 9344 × 7000 | 9344 × 7000 | 9344 × 7000 |
| XY resolution | 4.5 μm | 1.6 μm | 1.6 μm | 1.06 μm |
| Field of view | 23 × 18.4 mm | 14.95 × 11.2 mm | 14.95 × 11.2 mm | 9.97 × 7.46 mm |
| Minimum measurable component height (1) | 20 μm | 8 μm | 8 μm | 4 μm |
| Minimum gold / aluminium wire size | 2.0 mil (50 μm) | 0.8 mil (20 μm) | 0.8 mil (20 μm) | 0.5 mil (12.5 μm) |
| Height range (2) | 20 mm | 20 mm | 20 mm | 20 mm |
| Scan time (typical speed (3)) | <700 ms | <700 ms | <700 ms | <700 ms |
| Repeatability | 5 μm | 2 μm | 2 μm | 1 μm |
| Highly reflective / mirror objects measurable | No | No | Yes | Yes |
| Bright-field illumination | Yes | Yes | Yes | Yes |
APPLICATIONS
Industries and inspection projects
Industries
- Advanced semiconductor packaging
- Memory modules and micro-assembly
- High-speed optical communication modules
- Lead frames and infrared detectors
- MEMS devices
Inspection projects
- Wire-bond: wire sag, missing / extra wires, skew, bond-point height, diameter and offset
- Die-bond: die warpage, placement offset and glue height
- Micro-bumps: micro solder-paste height and bump flatness
- General defects: die surface topography, excess / missing glue and collapsed wires
- SIP: missing, damaged, misplaced, tilted or bridged components, solder defects, polarity and character recognition