- Event dates
- September 9–11, 2026
- Event location
- Shenzhen World Exhibition & Convention Center
- Booth
- Hall 14, 14C96
Mingjian Imaging will bring its self-developed products, production-proven processes and latest technology results to the 2026 IICIE International Integrated Circuit Innovation Expo.
The exhibition will demonstrate our R&D depth and field experience in advanced semiconductor packaging inspection.
Customers and industry partners are invited to visit booth 14C96 to discuss collaboration and build the next generation of advanced packaging together.